Mezalok High-Speed Low-Force XMC Connectors

TE Connectivity’s (TE) Mezalok High-Speed Low-Force (HSLF) XMC Connectors are designed for rugged embedded computing interconnects in mezzanine applications. The HSLF connectors utilise a rugged dual point contact system that meets the qualification requirements of legacy Mezalok high-speed connectors and a reliable ball grid array printed circuit board surface-mount application. These Mezalok High-Speed Low-Force XMC Connectors meet the same rugged standards as listed in VITA 47 and VITA 72. The 114-position connector is compliant with VITA 61 and is available in various positions and stack heights.

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Description Datasheet Availability Pricing (AUD) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
Number of Positions
Pitch
Number of Rows
Termination Style
Mounting Angle
Stack Height
Current Rating
Voltage Rating
Maximum Data Rate
Minimum Operating Temperature
Maximum Operating Temperature
Contact Plating
Contact Material
Housing Material
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TE Connectivity Board to Board & Mezzanine Connectors 60 Position, 1.27mm CL, Gold, Vertical
Datasheet
448In Stock
Min.: 1
Mult.: 1

Receptacles 60 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 12 mm 1.5 A - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP)
TE Connectivity Board to Board & Mezzanine Connectors 60 Position, 1.27mm CL, Gold, Vertical
Datasheet
350In Stock
Min.: 1
Mult.: 1
Reel: 450
No
Receptacles 60 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 12 mm 1.5 A - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) Reel, Cut Tape
TE Connectivity Board to Board & Mezzanine Connectors 114 Position, 1.27mm Gold, Vertical
Datasheet
442In Stock
Min.: 1
Mult.: 1

Receptacles 114 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 10 mm 1.5 A 250 VAC 32 Gbps - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP)


TE Connectivity Board to Board & Mezzanine Connectors 60 Position, 1.27mm CL, Gold
Datasheet
354In Stock
Min.: 1
Mult.: 1
Reel: 450
No
Receptacles 60 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 10 mm 1.5 A - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) Reel, Cut Tape
TE Connectivity Board to Board & Mezzanine Connectors 114 Position, 1.27mm Gold, Vertical
Datasheet
76In Stock
Min.: 1
Mult.: 1
Reel: 350

Receptacles 114 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 12 mm 1.5 A 250 VAC 32 Gbps - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) Reel, Cut Tape
TE Connectivity Board to Board & Mezzanine Connectors 60 Position, 1.27mm CL, Gold, Vertical
Datasheet
431In Stock
Min.: 1
Mult.: 1

Receptacles 60 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 10 mm 1.5 A - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP)
TE Connectivity Board to Board & Mezzanine Connectors 114 Position, 1.27mm Gold, Vertical
Datasheet
90In Stock
Min.: 1
Mult.: 1
Reel: 350
No
Receptacles 114 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 12 mm 1.5 A 250 VAC 32 Gbps - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) Reel, Cut Tape
TE Connectivity Board to Board & Mezzanine Connectors 114 Position, 1.27mm, Gold, Vertical
Datasheet
Non-Stocked Lead-Time 24 Weeks
No
Receptacles 114 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 10 mm 1.5 A 250 VAC 32 Gbps - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP)