Bergquist Company TGP EMI1000 Conformable EMI Absorbing GAP PAD®

Bergquist Company TGP EMI1000 Conformable EMI Absorbing GAP PAD® offers both thermal conductivity performance and electromagnetic energy absorption (cavity resonances and/or cross-talk causing electromagnetic interference) at frequencies of 1GHz and higher. The GAP PAD EMI 1.0 provides EMI suppression and 1.0 W/m-K thermal conductivity performance with low assembly stress. The soft nature of the material enhances wet-out at the interface resulting in higher thermal performance than harder materials with a similar performance rating. GAP PAD EMI 1.0 has an inherent, natural tack on one side of the material eliminating the need for thermally-impeding adhesive layers and allowing improved handling during placement and assembly. The other side is tack-free, again enhancing handling and rework, if required. Bergquist Company TGP EMI1000 GAP PAD comes with a protective liner on the material's tacky side.


  • Thermal Conductivity: 1.0 W/m-K
  • Electromagnetic Interference (EMI) absorbing
  • Highly conformable, low hardness
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Electrically isolating


  • Consumer electronics
  • ASICs and DSPs
  • Telecommunications
  • PC applications
Published: 2015-08-13 | Updated: 2022-03-11